DSP

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DSP Modules

The example below is a 3U OpenVPX module that leverages on Intel® Stratix® V FPGA and Texas Instruments KeyStone Multicore DSP technology to provide an ultra-high bandwidth processing platform, ideally suited for computation and bandwidth intensive applications such as Radar, Networking, SIGINT, EW, SDR and Video. The onboard multicore DSP from Texas Instruments provides the flexibility toper form complex post processing functions more suited for the processor domain. High bandwidth communication between the DSP and FPGA is provided through both PCIe and Serial Rapid IO (SRIO) interfaces. The Stratix® V FPGA has two banks of dedicated DDR3 and QDRII+ memories for algorithms with high bandwidth and/or large memory size requirements. High speed serial interfaces to the OpenVPX data plane and the FMC site creates abundant FPGA IO throughput. This acts as an FMC carrier to provide a modular solution that accommodates wide range of I/O requirements. This conforms to the OpenVPX standard and operates as a Payload module with System Controller capability. Both air-cooled and conduction cooled versions are available. Further flexibility is provided through build options to cater for10 different FPGAs from Intel FPGA's Stratix® V GX and GS device families.